DTU requires a wire bonder to serve our users from university and commercial companies. It should be able to make wire bonding on chips to substrates of both R&D type to low volume production. This means a high variety of chip, bond pad and substrate designs and materials. Because of the many users, ease of operation is important for us.
09-07-2024 12:00:00
38000000-5 Laboratorieudstyr, optisk udstyr og præcisionsudstyr (ikke briller)
Danmarks Tekniske Universitet - DTU
Anker Engelunds Vej 1
2800
Kgs. Lyngby
Danmark
Vis profil
Pia Blume
https://www.dtu.dk
Bekendtgørelse | Afsendelsesdato |
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Varer og tjenesteydelser med klar grænseoverskridende interesse (Udbud.DK) | 07-06-2024 14:01 |