8978 - Purchase of Wire Bonder

DTU requires a wire bonder to serve our users from university and commercial companies. It should be able to make wire bonding on chips to substrates of both R&D type to low volume production. This means a high variety of chip, bond pad and substrate designs and materials. Because of the many users, ease of operation is important for us.

9.7.2024 12.00.00

38000000-5  Laboratoriolaitteet, optiset ja tarkkuuslaitteet (lukuun ottamatta silmälaseja)