DTU requires a wire bonder to serve our users from university and commercial companies. It should be able to make wire bonding on chips to substrates of both R&D type to low volume production. This means a high variety of chip, bond pad and substrate designs and materials. Because of the many users, ease of operation is important for us.
9-7-2024 12:00:00
38000000-5 Laboratoriuminstrumenten, optische en precisie-instrumenten (uitgezonderd brillen)
Danmarks Tekniske Universitet - DTU
Anker Engelunds Vej 1
2800
Kgs. Lyngby
Denemarken
Bekijk dit profiel
Pia Blume
https://www.dtu.dk
Type | Publicatiedatum |
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Supplies Services (Udbud.DK) | 7-6-2024 14:01 |